| 摘要 |
<p>PURPOSE: A light emitting device package and a manufacturing method thereof are provided to variously change the shape of a package mold and a cavity by controlling the shape of a mold when manufacturing the package mold. CONSTITUTION: A package mold(10) comprises a fluorescent substance and resin. The package mold is formed into a polygon structure, a circular structure, or an oval structure. An uneven structure or a pattern is formed on the surface of the package mold. A light emitting diode(11) is inserted within the package mold. An electrode connecting part(12) is formed on the upper side of the light emitting diode. An adhesion material is placed between the package mold and the light emitting diode.</p> |
