发明名称 RESIN COMPOSITION FOR ADHESIVE FILM AND THE ADHESIVE FILM USING THEREOF
摘要 <p>PURPOSE: A resin composition for an adhesive film is provided to have by semi-permanent by having excellent storage performance, to not have limitations of drying process, and to be able to improve reliability and adhesion of a package. CONSTITUTION: A manufacturing method of a resin composition for an adhesive film comprises: a step of preparing 5-60 weight% of a thermoplastic resin, 25-94.9 weight% of a thermosetting resin, and 0.1-30 weight% of a light-latent hardener; a step of preparing 40-250 weight% of an organic solvent based on a total weight of the thermoplastic resin, thermosetting resin and light-latent hardener combined; and a step of manufacturing the resin composition for the adhesive film by mixing and dissolving the thermoplastic resin, thermosetting resin, light-latent hardener, and the organic solvent.</p>
申请公布号 KR20120109145(A) 申请公布日期 2012.10.08
申请号 KR20110027378 申请日期 2011.03.28
申请人 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 PAIK, KYUONG WOOK;KIM, IL
分类号 C09J11/00;B05D5/10;C09J7/00;C09J201/00 主分类号 C09J11/00
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