CHIP SCALE PACKAGE ASSEMBLY IN RECONSTITUTION PANEL PROCESS FORMAT

摘要

PURPOSE: A chip scale package assembly by a reconfiguration panel processing format is provided to economically and effectively put together integrated circuits such as ball grid array packages. CONSTITUTION: A substrate panel which includes substrates having routing is formed(102). The substrate panel is singulated for dividing a plurality of substrates. A sub set of the divided substrates is attached to the surface of a carrier. One or more dies are mounted on the substrates of the carrier. The dies and the substrates on the carrier are encapsulated to a molding compound. The carrier is detached from the encapsulated dies and substrates. [Reference numerals] (102) A substrate panel which includes substrates having routing is formed; (104) The substrate panel is singulated for dividing a plurality of substrates.