A TRAY USING A SCRAPPED WAFER AND METHOD FOR MANUFACTURING THEREOF

摘要

PURPOSE: A tray using a scrapped wafer and a manufacturing method thereof are provided to reduce manufacturing costs by recycling the scrapped wafer. CONSTITUTION: A scrapped semiconductor wafer(100) is prepared. A mask layer is formed in the front of a semiconductor wafer. A pocket is formed on the semiconductor wafer by an etching process using the mask layer. An impact buffer layer(130) is formed in the front of the semiconductor wafer.