METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

摘要

PURPOSE: A manufacturing method of a circuit board and an electronic device are provided to easily inject resin into a gap between the circuit board and an electronic component by preparing the wide gap. CONSTITUTION: A first wiring pattern(12) is arranged on the surface of a first insulating layer(11) of a circuit board(10). A second insulating layer(13) coats the first wiring pattern. A second wiring pattern(14) is arranged on the surface of the second insulating layer. A third insulating layer(15) coats the second wiring pattern. A third wiring pattern(16) is arranged on the surface of the third insulating layer. A fourth insulating layer(17) coats the third wiring pattern. A first electrode pad(18) connects terminals formed on a body of an electronic component. A second electrode pad(19) is connected to an electrode pad.