| 摘要 |
The present invention relates to an apparatus for removing moisture which separates and removes moisture from a fluid discharged through a scrubber for removing waste gas generated in a semiconductor manufacturing process, and more particularly to an apparatus for removing moisture, including: an inflow tube which is connected to an exhaust tube of the scrubber in an erected state, and receives the fluid discharged from the scrubber; a moisture separation tank which is positioned at an upper side of the scrubber and separates the moisture from the fluid received through the inflow tube; a moisture collection tube which is connected to a lower surface of the moisture separation tank to drain the separated moisture to the outside; and a discharge tube which is connected to an upper surface of the moisture separation tank to discharge the moisture-removed fluid to the outside, wherein the moisture separation tank includes a contacting plate which is protruded from one side of an inner surface thereof, extended in a constant length in an opposite direction thereof, inclined in a lower surface direction toward an end thereof to obtain an intersection angle of an acute angle with respect to a central line of the inflow tube, and forms a vortex through collision with the fluid received through the inflow tube. The present invention provides an apparatus for removing moisture in which the occupied volume thereof can be minimized, the corrosion of the inflow tube can be effectively prevented, and wet air type moisture as well as liquefied moisture absorbed together with the fluid through scattering can be effectively separated and removed by maximizing an area which is in contact with the received fluid. |
