POLISHING SLURRY AND POLISHING METHOD THEREOF

摘要

The present invention provides a polishing technique which is capable of polishing, at a high speed, a base such as a sapphire single crystal substrate that contains Al and has a high hardness, and which is capable of providing a polished surface that has high surface accuracy. The present invention relates to a polishing slurry for polishing a base that contains aluminum, and the polishing slurry is characterized by containing abrasive grains, an inorganic boron compound having a solubility in water at 20°C of 0.1 g/100 g-H2O or more, and water. The inorganic boron compound content in the present invention is preferably from 0.1% by mass to 20% by mass relative to the polishing slurry in terms of boron atoms.