发明名称 SOCKET FOR ELECTRIC COMPONENT
摘要 This IC socket has: a main socket body; contact pins to be brought into contact with IC package terminals; and a latch for pushing, from above, an IC package housed inside the main socket body. The IC socket is configured such that elastic pieces of the contact pins are positioned roughly along the horizontal direction; and the latch is provided with cam sections in such a manner that the elastic pieces are pushed downward by the cam sections to elastically deform when the latch is turned in the opening direction whereby to displace the contact parts downward in order to separate the elastic pieces downward from the contact positions with the IC package terminals, and the pressing forces acted upon the elastic pieces by the cam sections are cancelled when the latch is turned in the closing direction whereby to displace the elastic pieces upward by means of an elastic force in order to allow the elastic pieces to come into contact with the IC package terminals.
申请公布号 WO2012133740(A1) 申请公布日期 2012.10.04
申请号 WO2012JP58526 申请日期 2012.03.30
申请人 ENPLAS CORPORATION;HAYAKAWA, KENJI 发明人 HAYAKAWA, KENJI
分类号 H01R33/76 主分类号 H01R33/76
代理机构 代理人
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