发明名称 |
SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AND METHOD FOR TRANSFERRING SOLDER |
摘要 |
In order to provide a solder transfer base which enables a transfer without breaking a fragile film of a semiconductor element that has a fragile dielectric film, the present invention provides a solder transfer base (5), which is provided with a base layer (1), an adhesive layer (2) that is arranged on the base layer (1), and a plurality of solder particles (3) that are arranged on the adhesive layer (2). The base layer (1) is a porous member, and is provided with a plurality of pores that pass through at least a remover liquid from the side on which the adhesive layer (2) is not arranged to the side on which the adhesive layer (2) is arranged. In addition, the adhesive layer (2) has such a characteristic that the adhesive layer (2) is expanded when the remover liquid is injected thereinto. |
申请公布号 |
WO2012132175(A1) |
申请公布日期 |
2012.10.04 |
申请号 |
WO2012JP00462 |
申请日期 |
2012.01.25 |
申请人 |
PANASONIC CORPORATION;SAKURAI, DAISUKE |
发明人 |
SAKURAI, DAISUKE |
分类号 |
H05K3/34;B23K1/00;B23K1/20;B23K3/06;B23K35/14;B23K35/26;B23K35/40;B23K101/42;C22C13/00;H01L21/60 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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