SUBSTRATE FOR ELEMENT MOUNTING, CELL, AND CELL MODULE

摘要

A substrate for element mounting (40) which comprises: a heat sink base (10) constituted of a material comprising at least one metal selected from the group consisting of Al, Mg, and Ti; an insulating resin layer (42) superposed on the heat sink base; and a wiring layer (44) on which a power module is to be mounted and which has been superposed on the insulating resin layer. The heat sink base (10) has a randomly porous layer (14) which has been disposed so as to face the insulating resin layer (42) and in which slender voids extending in random directions have been formed.