| 摘要 |
<p>Provided is a resin composition comprising a binder resin (A), a silane-modified resin (B), and a compound (C) having an acidic group or a thermally latent acidic group, the resin composition being characterized in that the proportion of the silane-modified resin (B) and the compound (C) having an acidic group or a thermally latent acidic group, when expressed as "silane-modified resin (B)/compound (C) having an acidic group or a thermally latent acidic group," ranges from 0.5 to 20.</p> |
