PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, FORMING METHOD FOR RIB PATTERN, FORMING METHOD FOR HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT

摘要

A photosensitive resin composition, comprising a photopolymerisable initiator (B) and a photopolymerisable compound (A) containing a urethane compound (A1) having at least one type of an acryloyl group and a methacryloyl group, has excellent heat and moisture resistance, has high elasticity in a cured product, also has excellent hollow-structure maintainability, and is suitable as a material used as a rib material and/or a lid material that form the hollow structure in an electronic component having a hollow structure.