发明名称 |
Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module |
摘要 |
A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board. |
申请公布号 |
US2012246926(A1) |
申请公布日期 |
2012.10.04 |
申请号 |
US201213523990 |
申请日期 |
2012.06.15 |
申请人 |
LIN WEN-HSIN;LAI CHING-KUN;CHEN CHIEN-HUNG;AU OPTRONICS CORPORATION |
发明人 |
LIN WEN-HSIN;LAI CHING-KUN;CHEN CHIEN-HUNG |
分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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