| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer in which the bottom face of a circular recess is not contaminated with foreign matter during transportation, and to provide a transfer method of wafer. <P>SOLUTION: In a wafer having a circular recess and an annular protrusion of a predetermined width surrounding the circular recess, a plurality of dents are provided locally in the inner peripheral wall of the annular protrusion. In the transfer method, a plurality of support fingers are inserted into the dents formed in the inner peripheral wall of the annular protrusion, and the wafer is transferred while supporting the inner peripheral wall of the annular protrusion by means of the support fingers. <P>COPYRIGHT: (C)2013,JPO&INPIT |
