| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate bonding apparatus which can detect a progress state of bonding, and to provide a substrate bonding method. <P>SOLUTION: The substrate bonding apparatus according to an embodiment comprises: a mounting part having a first substrate mounted thereon; a substrate support part which supports a peripheral part of a second substrate that faces the first substrate mounted on the mounting part at a predetermined interval; a contact part which brings one part of a surface to be bonded of the second substrate with one part of a surface to be bonded of the first substrate; a plurality of light receiving parts provided side by side from a position at which the one part of the surface to be bonded of the second substrate is in contact with the one part of the surface to be bonded of the first substrate in a plan view; a light projecting part which emits light to be entered in the light receiving parts; and a calculation part which calculates the progress state of bonding based on output from the light receiving parts. <P>COPYRIGHT: (C)2013,JPO&INPIT |
