| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component in which a wiring conductor of metal foil and an interlayer connection conductor can be bonded. <P>SOLUTION: The electronic component includes: resin layers 30, 30x-30z; wiring conductors 10p-10r, 12p-12r, 14p-14r, 16p-16r, 18p-18r arranged on the principal surfaces of the resin layers 30, 30x-30z; and interlayer connection conductors 11, 13, 15, 17 penetrating the resin layers 30, 30x-30z and having both ends connected with the wiring conductors 10p-10r, 12p-12r, 14p-14r, 16p-16r, 18p-18r, respectively. In the interlayer connection conductors 11, 13, 15, 17, first and second ends 22, 22x-22z; 20, 20x-20z including both ends, respectively, in the resin layers 30, 30x-30z are formed using materials different from each other, and at least the first ends 22, 22x, 22y, 22z are connected with wiring conductors formed using metal foil. <P>COPYRIGHT: (C)2013,JPO&INPIT |
