| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device having a structure where void is not entrained in a recess by improving the air exit from the recess in a structure having protrusions including recesses, and to provide a manufacturing method of resin sealed semiconductor device having a structure where a void is not entrained in the recess. <P>SOLUTION: In a mounting region 16 on one surface 11 of a heat sink 10 where a semiconductor element 30 is mounted, the heat sink 10 has linear protrusions 13 each consisting of a linear recess 14 formed in one direction out of the plane directions of the surface 11, and protrusions 15 located on both sides of the recess 14. Since the bonding layer 20 is easy to get wet in one direction, i.e. the extension direction of the recess 14, the air in the recess 14 exits easily resulting in a structure where a void is not entrained in the recess 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
