发明名称 THIN-FILM TRANSISTOR ARRAY SUBSTRATE, THIN-FILM INTEGRATED CIRCUIT DEVICE, AND METHOD FOR MANUFACTURING THEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin-film transistor (TFT) array substrate which has excellent TFT characteristics and is capable of securing display quality and interlayer insulation properties of circuit wiring and the like. <P>SOLUTION: A manufacturing method of a thin-film transistor (TFT) array substrate comprises: a step of forming a pattern of an oxide semiconductor film 3 on a base material 1; a step of forming a source electrode connection region 3s and a drain electrode connection region 3d on the oxide semiconductor film; a step of forming a gate insulating film 4 covering the oxide semiconductor film; a step of opening a contact hole in the gate insulating film, connecting a source electrode 6s to the source electrode connection region and a drain electrode 6d to the drain electrode connection region, forming a gate electrode 7 on the oxide semiconductor film via the gate insulating film, and then forming a first circuit wiring group 17; a step of forming an interlayer insulating film 18 on the source electrode, drain electrode, gate electrode, and first circuit wiring group; and a step of forming a second circuit wiring group 19 on the interlayer insulating film. The thickness of the gate insulating film 4 is in the range of 100 nm to 500 nm. The thickness of the interlayer insulating film 18 is greater than or equal to 1 &mu;m and 2 to 10 times the thickness of the gate insulating film 4. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012191025(A) 申请公布日期 2012.10.04
申请号 JP20110053833 申请日期 2011.03.11
申请人 DAINIPPON PRINTING CO LTD 发明人 GOTO DAISUKE
分类号 H01L29/786;H01L21/336 主分类号 H01L29/786
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