发明名称 CHEMICAL MECHANICAL POLISHING OF GROUP III-NITRIDE SURFACES
摘要 A method of chemically-mechanically polishing a substrate having a Group III-nitride surface includes providing a chemical-mechanical polishing slurry composition. The slurry composition includes a slurry solution including a liquid carrier and an oxidizer including a transition metal or a per-based compound. The slurry solution includes at least one component that reacts with the Group III-nitride surface to form a softened Group III-nitride surface. The Group III-nitride comprising surface is contacted with the slurry composition by a pad to form the softened Group III-nitride surface. The pad is moved relative to the softened Group III-nitride surface, wherein at least a portion of the softened Group III-nitride surface is removed.
申请公布号 US2012252213(A1) 申请公布日期 2012.10.04
申请号 US201113073582 申请日期 2011.03.28
申请人 SINGH RAJIV K.;ARJUNAN ARUL CHAKKARAVARTHI;SINGH DEEPIKA;MISHRA ABHUDAYA;UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.;SINMAT, INC. 发明人 SINGH RAJIV K.;ARJUNAN ARUL CHAKKARAVARTHI;SINGH DEEPIKA;MISHRA ABHUDAYA
分类号 H01L21/306 主分类号 H01L21/306
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