WIRING BOARD AND METHOD FOR MANUFACTURING SAME

摘要

Provided is a wiring board (1000) which comprises: a core substrate (100a) comprising a first face (F1) and a second face (F2) on the opposite side to the first face (F1); a first conductor pattern formed on the first face (F1) of the core substrate (100a); first insulation layers (110a - 150a) formed on the first face (F1) and first conductor pattern of the core substrate (100a); a second conductor pattern formed on the second face (F2) of the core substrate (100a); second insulation layers (210a - 250a) formed on the second face (F2) and second conductor pattern of the core substrate (100a); and an inductor part (10) provided on the second face (F2) of the core substrate (100a) and formed from at least part of the second conductor pattern. The thickness of any of the second insulation layers (210a - 250a) is less than that of the first insulation layers (110a - 150a).