发明名称 COMPONENT BUILT-IN SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a component built-in substrate capable of stably maintaining accurate operation of the component built-in substrate by reducing the impact of a ground conductor on an electronic component while ensuring the area of the ground conductor sufficiently, and avoiding electromagnetic interference from an interference source, i.e. a signal line, thereby preventing malfunction of the electronic component or degradation of performance thereof. <P>SOLUTION: A first conductor layer 1 has a first ground electrode 11, and a second conductor layer 2 has a second ground electrode 21. An electronic component 8 has a specific region 81 where the characteristics change when a conductor is arranged in close proximity. An opening region 13 is formed in the first ground electrode 11 so that the specific region 81 can be seen through from the second insulation layer 6 side. Furthermore, a ground conductor 9 penetrating the second insulation layer 6 and connecting the first ground electrode 11 and the second ground electrode 21 electrically is provided on the component built-in substrate 20. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012190923(A) 申请公布日期 2012.10.04
申请号 JP20110051878 申请日期 2011.03.09
申请人 TDK CORP 发明人 YAGINUMA ICHIRO;SUGIOKA TERUYASU;ABE TOSHIYUKI
分类号 H05K3/46 主分类号 H05K3/46
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