发明名称 PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a processing device which can split a large workpiece with excellent precision. <P>SOLUTION: The processing device includes first and second chuck tables, and first and second processing means. The first and second chuck tables are positioned at a combination position where the holding surfaces are continuous, and a separation position by a positioning means. A workpiece is mounted on the first and second chuck tables while positioning the first and second chuck tables at the combination position, and then split by a split means. A first workpiece is processed by the first processing means, and a second workpiece is processed by the second processing means. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012190932(A) 申请公布日期 2012.10.04
申请号 JP20110051992 申请日期 2011.03.09
申请人 DISCO ABRASIVE SYST LTD 发明人 SAITO TAKAHIRO
分类号 H01L21/301;B23K26/00;B23K26/08;B23K26/10;B23K26/38 主分类号 H01L21/301
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