| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows appropriately performing replacement due to product life cycle by predicting the product life cycle by appearance. <P>SOLUTION: A semiconductor device 10 comprises: a semiconductor chip 1; a circuit board 2 on which the semiconductor chip 1 is mounted; and a base plate 3 mounted on the surface of the circuit board 2 opposite to the surface on which the semiconductor chip 1 is mounted. The base plate 3 includes a first member 31 having a first surface 3a on the side on which the circuit board 2 is mounted and a second surface 3b opposite to the first surface 3a, and a second member 32 having a different thermal expansion coefficient from that of the first member 31. The periphery of the second member 32 is surrounded by the first member 31 so as not to appear on the surface of the first electrode 31. <P>COPYRIGHT: (C)2013,JPO&INPIT |
