| 摘要 |
A LED array (1) has an assembly of LED packages (2). The LED packages (2) are mounted to a substructure having circuitry and a heat transfer plate (4). Each LED package 2 has electrical connection terminals (22) and a thermal connection pad (24), with the electrical terminals (22) electrically connected to respective circuit conductors of the circuitry and the thermal pads (24) connected to the heat transfer plate (4) by respective thermally conductive connections. At least one of the LED packages (2) is tilted at an angle relative to an adjacent portion of the substructure. |
