RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, DRY FILM, OPTICAL WAVEGUIDE, AND PHOTOELECTRIC COMPOSITE WIRING BOARD USING SAME

摘要

Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and a dry film, optical waveguide, and photoelectric composite wiring board obtained from this composition. This resin composition for an optical waveguide is characterized in containing: an epoxy resin (A) comprising a solid epoxy resin the molecule of which has at most one hydroxyl group and a liquid epoxy resin the molecule of which has at most one hydroxyl group; (B) a curing agent the molecule of which has at most one hydroxyl group; and (C) a nano-scale silica sol; and is also characterized in not containing any compound the molecule of which contains two or more hydroxyl groups, as a resin component.