HEATING DEVICE

摘要

A heating device is provided with a base plate and a face plate (3) on which a wafer is placed and which is positioned above the base plate, wherein: the face plate (3) is provided with an aluminum substrate (31), a film heater (32B) for heating a wafer (W) disposed on the aluminum substrate (31), and a gap ball (6) disposed on the aluminum substrate (31) between the wafer (W); a second attachment hole (3B) into which the gap ball (6) is press fitted is disposed on the aluminum substrate (31); and the gap ball (6) is held only by the inner wall surface of the second attachment hole (3B) by being press fitted.