| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for semiconductor adhesion, which is excellent in stress relaxation property as well as adhesion strength, and can enhance solder crack resistance or the like in a semiconductor device. <P>SOLUTION: The thermosetting resin composition for semiconductor adhesion includes, as essential components, (A) a polysulfide-modified epoxy resin represented by general formula (1); (B) an epoxy resin other than the polysulfide-modified epoxy resin of the component (A); (C) a hardener; and (D) a filler. (In the formula, R<SP POS="POST">1</SP>represents a divalent organic group having a bisphenol frame, m represents an integer of 1-3 independently for each repeat unit, and n represents an integer of 1-50). <P>COPYRIGHT: (C)2013,JPO&INPIT |
