| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a booklet cover with IC which allow a cover sheet to be easily pasted on an inlay and reduce defective products. <P>SOLUTION: In the method for manufacturing the booklet cover with IC formed by pasting the cover sheet on a base sheet having at least one IC module, an adhesive layer is provided on a pasting surface between the cover sheet and the base sheet, the base sheet is arranged so that the adhesive layer of the cover sheet may be partially exposed by forming an opening in a back portion of the booklet or forming the base sheet on the adhesive layer being separated from side to side in the back portion, and a laminate formed of the cover sheet and the base sheet is adhered by pressing the laminate with a press roll where a first roll having a wider width than the cover sheet is located at the cover sheet side, and a second roll having a groove is located at the base sheet side while arranging the groove so that the roll may not come into contact with the exposed adhesive layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
