| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board having a double side structure or a multilayer structure which has high density and an excellent wiring housing function and achieves stable interlayer electrical connection. <P>SOLUTION: A circuit board for an inner layer electrically connects with an outer layer circuit through conduction holes of an insulation base material for interlayer connection, and a hardening part is selectively formed on the insulation base material for the interlayer connection. The structure minimizes variations caused in the manufacturing processes of the circuit board, dimension changes of the insulation base material or the insulation base material for the interlayer connection, and the like and improves the positioning accuracy of the lamination of the circuit board having the multilayer structure. <P>COPYRIGHT: (C)2013,JPO&INPIT |
