发明名称 SUBSTRATE HOUSING CONTAINER
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate housing container capable of effectively eliminating the possibility that dust such as particles or the like contaminate a substrate by preventing a housing body and a lid from easily causing friction when opening and closing the lid. <P>SOLUTION: In this substrate housing container, a lid 10 is detachably fitted to the open front 2 of the housing body 1 for arranging and housing a plurality of semiconductor wafers W, and the peripheral wall of the lid 10 is brought into contact with the frontal and inner periphery of the housing body 1. An almost half spindle-shaped or almost trapezoidal evasion part 30 in a cross-sectional view is concavely formed at least one of the frontal and inner periphery of the housing body 1 and the peripheral wall of the lid 10, and particles caused by friction between the frontal and inner periphery of the housing body 1 and the peripheral wall of the lid 10 are prevented from being produced by the evasion part 30. Even if the inside of the substrate housing container is brought into a reduced pressure state, the easily deformable upper center, lower center, and both side centers on the front 2 of the housing body 1 can be prevented from being bent inward and warped. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012190898(A) 申请公布日期 2012.10.04
申请号 JP20110051414 申请日期 2011.03.09
申请人 SHIN ETSU POLYMER CO LTD 发明人 OGAWA OSAMU;KAMATA TOSHIYUKI
分类号 H01L21/673;B65D85/86 主分类号 H01L21/673
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