| 摘要 |
A cooling device has a finless heat sink (1) which is rectangular in plan, having two spaced-apart plates (5, 6). A fan impeller (2) and motor (3) are supported between the plates (5, 6) for axial air flow in (7) and radial flow out. The device is placed on an electronic component (4) to be cooled. The component (4) may be an electronic package, for example. The heat sink (1) is manufactured from a single piece of conducting material. There is a rotor support (8) on the top plate (5), supporting a fan rotor (3). The rotor support (8) is in a device inlet for axial flow into the fan impeller (2). There are two opposed side walls (9) interconnecting the plates 5 and 6. The device outlet is the gap between the plates (5, 6) along the open sides. The cooling device is very efficient, compact, and inexpensive to manufacture. |
