发明名称 POLYIMIDE FILM AND METAL LAMINATE USING SAME
摘要 <p>The present invention provides a polyimide film having no foaming during heating nor other problems, as well as a polyimide metal laminate in which the film and a metal layer have been laminated. The present invention relates to a polyimide film comprising a polyimide layer (b) and a polyimide layer (a) laminated in contact with the polyimide layer (b), wherein the surface of the polyimide layer (b) not in contact with the polyimide layer (a) has thermal adhesiveness, the surface of the polyimide layer (a) not in contact with the polyimide layer (b) does not have thermal adhesiveness, and the polyimide layer (a) comprises a polyimide obtained from a diamine component and a tetracarboxylic acid component containing 2,3,3',4'-biphenyl tetracarboxylic dianhydride.</p>
申请公布号 WO2012133594(A1) 申请公布日期 2012.10.04
申请号 WO2012JP58264 申请日期 2012.03.28
申请人 UBE INDUSTRIES, LTD.;KOCHIYAMA, TAKURO;MASUI, EIJI;YANAGIDA, KEIICHI;UEKIDO, TAKESHI 发明人 KOCHIYAMA, TAKURO;MASUI, EIJI;YANAGIDA, KEIICHI;UEKIDO, TAKESHI
分类号 B32B27/34;C08G73/10;C08J5/18;C08J7/04;H05K1/03 主分类号 B32B27/34
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