| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor device for electric power which is excellent in moisture proof and heat radiation. <P>SOLUTION: A semiconductor device for electric power includes: a metal heat sink 1; a resin insulation layer 2 joined to one surface of the metal heat sink 1; a metal plate 3 (a conductive substrate) disposed on a surface of the resin insulation layer 2 which is opposite to a surface where the metal heat sink 1 is joined; a semiconductor element for electric power 4 disposed on the metal plate 3; a sealing resin 8 sealing the metal heat sink 1, the resin insulation layer 2, the metal plate 3, and the semiconductor element for electric power 4 so that an entire heat radiation surface 1a of the metal heat sink 1 is exposed; and metal foils 10 tightly adhered to the heat radiation surface 1a of the metal heat sink 1 through adhesive layers 11 so as to cover borders between the heat radiation surface 1a and the sealing resin 8. <P>COPYRIGHT: (C)2013,JPO&INPIT |
