The present invention relates to a method for cutting a substrate by introducing thermomechanical tensile stress, and a device. The method according to the present invention: (a) supplies a substrate to be cut; (b) supplies electricity and thermal energy to the substrate by one or more electrode means connected to an AC voltage source, and supplies AC voltage and an electric current to a predetermined region of the substrate at a frequency in the range of 1 kHz to 10 GHz to heat the region; (c) cools the region; and (d) during step (b), moves the electrode and/or the substrate relative to the other, thereby moving the region along a path on the substrate surface and cutting the substrate along the path.
