| 摘要 |
The present invention relates to a manufacturing method of a carrier for testing a semiconductor, which includes a step for preparing a carrier main body groove corresponding to the shape of a carrier main body, a lever groove which is separated from the carrier main body groove at a predetermined distance and corresponds to the shape of a lever, and an upper injection mold and a lower injection mold which are provided between the carrier main body groove and the lever groove, and include an insert groove wherein a leaf plate is inserted; inserting the leaf spring into the insert groove; and a step for insert injection molding a carrier for testing a semiconductor by combining the upper injection mold and the lower injection mold, and injecting injection resin. |
