发明名称 SUSPENSION BOARD WITH CIRCUIT
摘要 A suspension board with circuit includes a conductive pattern on a top surface thereof. A folded-back portion that is capable of being folded back toward a back surface side is provided therein. At the circumference edge of the folded-back portion, a part of the circumference edge is continuous to the suspension board with circuit around the folded-back portion via a bent portion and the remaining portion of the circumference edge is disposed apart from the suspension board with circuit around the folded-back portion by a penetrating space that penetrates the suspension board with circuit in a thickness direction. The conductive pattern at least includes a top-surface-side terminal that is disposed on the top surface of the suspension board with circuit and a back-surface-side terminal that is disposed in the folded-back portion.
申请公布号 US2012247824(A1) 申请公布日期 2012.10.04
申请号 US201213422692 申请日期 2012.03.16
申请人 OHSAWA TETSUYA;NITTO DENKO CORPORATION 发明人 OHSAWA TETSUYA
分类号 H05K1/11 主分类号 H05K1/11
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