SUBSTRATE TRANSFER CARRIER

摘要

The purpose of the present invention is to provide a substrate transfer carrier which mitigates faults in mounting electronic components on a substrate being transferred in a high temperature environment, and improves mounting efficiency. This substrate transfer carrier is used to transfer a substrate and is provided with an adhesive layer which is peelably bonded to the lower surface of the substrate, and an aluminum substrate to which the adhesive layer is affixed. The aluminum substrate includes manganese content of 0.3% by weight or greater and contains substantially no magnesium and chromium.