发明名称 LED MOUNTING SUBSTRATE AND MANUFACTURING METHOD OF LED MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED mounting substrate which reduces the cost of an LED module. <P>SOLUTION: An LED mounting substrate 10 is formed extending in one direction, and multiple LEDs 2 are mounted on the LED mounting substrate 10 so as to be arranged parallel to each other in the one direction. In the LED mounting substrate 10, a base material 13 made of polyimide, wiring layers 15 disposed directly on one surface of the base material 13 and formed by copper foil, and a heat radiation layer 14 disposed directly on the other surface of the base material 13 and formed by metal foil are laminated to be formed into a flexible film shape. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012191114(A) 申请公布日期 2012.10.04
申请号 JP20110055268 申请日期 2011.03.14
申请人 SHARP CORP 发明人 OHATA TAKAFUMI
分类号 H01L33/48 主分类号 H01L33/48
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