| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing film with a protection film which shortens a down time, and can stick a dicing film onto a semiconductor wafer without positional deviation. <P>SOLUTION: In the dicing film with the protection film in which a dicing film and a protection film are stacked, a difference between the transmissivity at a wavelength of 600-700 nm of the protection film and the transmissivity of the dicing film with the protection film in a portion through which light for film detection of the dicing film firstly transmits is 20% or more. <P>COPYRIGHT: (C)2013,JPO&INPIT |
