发明名称 III-NITRIDE SEMICONDUCTOR STRUCTURES WITH STRAIN-ABSORBING INTERLAYER TRANSITION MODULES
摘要 <P>PROBLEM TO BE SOLVED: To provide various semiconductor structures including strain-absorbing III-Nitride interlayer modules. <P>SOLUTION: The semiconductor structure comprises a substrate and a first transition body over the substrate. The first transition body has a first lattice parameter at a first surface and a second lattice parameter at a second surface opposite the first surface. The semiconductor structure further comprises a second transition body, such as a transition module, having a smaller lattice parameter at a lower surface overlying the second surface of the first transition body and a larger lattice parameter at an upper surface of the second transition body, as well as a III-Nitride semiconductor layer over the second transition body. The second transition body may consist of two or more transition modules, and each of the transition modules may include two or more interlayers. The first and second transition bodies reduce strain for the semiconductor structures. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012191202(A) 申请公布日期 2012.10.04
申请号 JP20120043950 申请日期 2012.02.29
申请人 INTERNATL RECTIFIER CORP 发明人 BRIERE MICHAEL A
分类号 H01L21/20;C30B29/38 主分类号 H01L21/20
代理机构 代理人
主权项
地址