| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide both improvement in embedding characteristic of an inner layer circuit and precision in thickness. <P>SOLUTION: A prepreg 1 for buildup includes a fiber base material 2 and resin layers 3 and 4 provided on both surfaces of the fiber base material 2, and is compatible with IPC-TM-650 Method 2.3.17, to show the resin flow of 15-50 wt.% when measured after heated and pressurized for five minutes under the condition of 171±3°C, 1380±70 kPa. Under a condition in which the prepreg 1 is sandwiched between a pair of rubber plates facing each other, when heated and pressurized under the condition of 120°C, 2.5 MPa, the weight of the resin layers 3 and 4 that protrude from the outside edge of the fiber base material 2 in a plan view is 5 wt.% or less against the entire resin layers 3 and 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
