发明名称 WIRING BOARD MOUNTING STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To use even a chassis possessing a high profile swollen part and a low profile swollen part together for mounting a wiring board which requires to be arranged while covering the high profile swollen part and the low profile swollen part. <P>SOLUTION: The chassis 10 includes a high profile swollen part 20 and a low profile swollen part 30. The counter space of a wiring board 50 screwed to the top of the high profile swollen part 20 and the top of the low profile swollen part 30 is filled with a spacer 60. The spacer 60 includes at least one of a first positioning mechanism 70 and a second positioning mechanism 80. The first positioning mechanism 70 and the second positioning mechanism 80 can be formed of a cylindrical projection or a threaded shaft or a screw shaft. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012191080(A) 申请公布日期 2012.10.04
申请号 JP20110054799 申请日期 2011.03.11
申请人 FUNAI ELECTRIC CO LTD 发明人 ISHIBASHI KAZUHIRO
分类号 H05K7/14 主分类号 H05K7/14
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