ELECTROLESS PLATING APPARATUS, METHOD OF ELECTROLESS PLATING, AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

An electroless plating solution is contained in a plating tank of an electroless plating apparatus. A reference electrode and a counter electrode are immersed in the electroless plating solution. A conductive member is provided to be electrically in contact with a conductive layer formed of a long-sized substrate. The conductive member, the reference electrode, and the counter electrode are connected to a potentiostat. The potentiostat controls an electric current that flows between the conductive layer formed of the long-sized substrate and the counter electrode such that a potential of the conductive layer formed of the long-sized substrate (working electrode) is at a constant level with respect to a potential of the reference electrode.