MULTILAYER PRINTED WIRING BOARD MANUFACTURING METHOD, AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY SAID MANUFACTURING METHOD

摘要

The purpose of the present invention is to provide a multilayer printed wiring board manufacturing method which, even if manufactured with the coreless build-up method using a copper foil which has an attached carrier foil and is provided with a heat-resistant metal layer, does not require removal of the heat-resistant metal layer. In order to achieve this purpose, a multilayer printed wiring board manufacturing method is adopted in which a copper foil with attached carrier foil (10) provided with at least four layers, a carrier foil (11) / a release layer (12) / a heat-resistant metal layer (13) / a copper foil layer (14), is used to obtain a support substrate (16) comprising an insulating layer constituent material (15) bonded to the surface of the carrier layer (14) of said copper foil with attached carrier foil (10); a build-up wiring layer (20) is formed on the surface of the copper foil layer (11) of the copper foil with attached carrier foil (10) of said support substrate (16) as a support substrate with attached build-up wiring layer (21), which is released by the release layer (12), achieving a multi-layer laminate plate (1); further processing necessary for said multi-layer laminate plate (1) is performed to obtain the multilayer printed wiring board.