发明名称 |
SLUDGE SEPARATION TREATMENT DEVICE FOR CONTINUOUS ELECTROPLATING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sludge separation treatment device for a continuous electroplating apparatus, which efficiently removes sludge from a plating solution without interrupting a continuous electroplating treatment to keep the plating solution clean. <P>SOLUTION: The sludge separation treatment device includes: a continuous electroplating treatment bath 1 for subjecting a material to be plated running between electrodes to the continuous electroplating treatment; a plating solution circulation bath 2 for continuously circulating the plating solution between the continuous electroplating treatment bath 1 and the plating solution circulation bath; a sludge sedimentation tank 4 for adding a coagulation settling agent into the plating solution containing the sludge partially extracted from the plating solution circulation bath 2 and sent with a liquid thereto and stirring and mixing the agent and the solution to sediment the sludge in the plating solution; and a plating solution storage tank 6 for storing a supernatant liquid sent from the sludge sedimentation tank 4 and supplying the stored plating solution to the plating solution circulation bath 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012188715(A) |
申请公布日期 |
2012.10.04 |
申请号 |
JP20110054524 |
申请日期 |
2011.03.11 |
申请人 |
NIPPON STEEL ENGINEERING CO LTD |
发明人 |
SHIMAMURA MICHIHIRO |
分类号 |
C25D21/18;B01D21/01;B01D21/02;C02F1/52 |
主分类号 |
C25D21/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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