| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaning method for cleaning and removing resin adhering to a plunger side of a transfer molding device. <P>SOLUTION: In the cleaning method: a tip of a plunger (7) projects from a pot (6) into a cavity (5) and a cleaning target area including at least a location position of the pot (6) of the cavity (5) is sealed on an immediately-before position where the cavity (5) is formed by mold-closing, and liquid is injected into the cleaning target area from a supply port (10) and the liquid in the cleaning target area is discharged from an outlet (11) to the outside, thereby cleaning the apparatus. <P>COPYRIGHT: (C)2013,JPO&INPIT |
