发明名称 |
METHOD FOR THERMALLY CONTACTING OPPOSING ELECTRICAL CONNECTIONS OF A SEMICONDUCTOR COMPONENT ARRANGEMENT |
摘要 |
The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof. |
申请公布号 |
US2012252144(A1) |
申请公布日期 |
2012.10.04 |
申请号 |
US201013395121 |
申请日期 |
2010.09.08 |
申请人 |
SCHROEDER MATTHIAS;SCHROEDER DOMINIC;HENNIG PETRA;JENOPTIK LASER GMBH |
发明人 |
SCHROEDER MATTHIAS;SCHROEDER DOMINIC;HENNIG PETRA |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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