发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 A space is provided under part of a semiconductor layer. Specifically, a structure in which an eaves portion (a projecting portion, an overhang portion) is formed in the semiconductor layer. The eaves portion is formed as follows: a stacked-layer structure in which a conductive layer, an insulating layer, and a semiconductor layer are stacked in this order is etched collectively to determine a pattern of a gate electrode; and a pattern of the semiconductor layer is formed while side-etching is performed.
申请公布号 US2012248513(A1) 申请公布日期 2012.10.04
申请号 US201213517879 申请日期 2012.06.14
申请人 MIYAIRI HIDEKAZU;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 MIYAIRI HIDEKAZU
分类号 H01L29/78 主分类号 H01L29/78
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