| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing sheet which can be closely stuck with excellent followability to a rear face of a wafer in which only a rear face inner periphery of the wafer is ground, an annular projection is provided at an outer periphery and then a step is formed between an inner periphery plane and the annular projection, and securely holds the wafer and a chip during dicing even when the time elapses after adhesion. <P>SOLUTION: The dicing sheet includes a base material and an adhesive formed on its one face, and is characterized in that the Young's modulus of the base material is 80-300 MPa, a stress relaxation rate thereof is 60% or more after one minute of 10% elongation, and furthermore the thickness thereof is 50-120 μm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
