CONDUCTIVE SINTERED LAYER FORMING COMPOSITION, AND CONDUCTIVE COATING FILM FORMING METHOD AND JOINTING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive sintered layer forming composition in which lowering of heating temperature and shortening of heating time can be achieved in a process in which sintering by heating or jointing by sintering is promoted with respect to metal nano particles covered with an organic substance, and to provide a conductive sintered layer forming method.

SOLUTION: The conductive sintered layer forming composition utilizes a phenomenon that, by mixing metal particles having a particle size of 1 nm to 5 μm covered with the organic substance and silver oxide, they can be sintered at a low temperature compared with the single substance. The conductive sintered layer forming composition contains the metal particles having a particle size of 1 nm to 5 μm covered with the organic substance and the silver oxide.

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